Datacon 2200 manual

The Datacon evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the Datacon evo is prepared for present and future processes and products. Datacon evo • High speed multi chip module assembly • SiP – stacked die / epoxy, spacer film and WBL (Wafer Backside Lamination) • Thin die handling (down to below 30 µm) • Reticle (multi-project) wafers • Fast product change due to recipe driven tool change • Highest performance in the high end market, up to 7, UPH. www.doorway.ru › Datacon Evo Manual. evo evo plus. -Film Foil In Development Next generation Die Attach •Next generation Packaging •Common modules Datacon Datacon Fico Meco Fico New 8 Fico. •Besi has full range of AP systems. E revenue: 70% substrate/wafer level vs. 30% leadframe.

Accuracy Flexibility for your mass production. The new Datacon evo advanced is the latest edition in the well- established and field proven Multi Module Attach platform of www.doorway.ru an all new gantry controller system as well as a completely new vision and camera generation Datacon evo advanced offers superb 3μm placement accuracy while still focusing on your productivity and. Datacon evo • High speed multi chip module assembly • SiP – stacked die / epoxy, spacer film and WBL (Wafer Backside Lamination) • Thin die handling (down to below 30 µm) • Reticle (multi-project) wafers • Fast product change due to recipe driven tool change • Highest performance in the high end market, up to 7, UPH. The Datacon EVO high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for Flip Chip applications. Equipped with integrated dispenser, 12' wafer handling, automatic tool changer and application specific tooling, the Datacon EVO is prepared for present and future processes and products.

Datacon's evolving apm die bonder generation outperforms the a leading manufacturer of manual and semi-automatic screen printers with nearly Datacon evoplus Innovative Solution for Innovative Products The Datacon evoplus die bonder for Multi Module Attach assembles all kinds of. Documentation / MANUAL is in German. Please note that this description may have been translated automatically. Contact us for further information. The.